Industrial Half Slim Embedded Module

Cervoz_M350 Family
Cervoz_M350 Family

M350 Family

Industrial Half Slim Embedded Module

Features

  • Compliant with SATA III 6.0Gb/s
  • MLC NAND flash memory
  • Capacity: 32GB ~ 128GB
  • Operating as boot disk
  • Static and dynamic wear leveling
  • Bad block management
  • S.M.A.R.T. & TRIM command
  • Included standard & wide temp. range
Cervoz Industrial Half Slim Embedded Module M350 family is a Solid State Disk product that is in compliance with the SATA III standards. The device design is based on the 7pin for data segment and 15pin for power segment standards. The Half Slim Embedded Module M350 family fits in any 7+15 SATA sockets on a motherboard; it can be used for both booting or storage purposes.

M350 family uses superior quality preselected multi-level cell (MLC) NAND flash memory from the industry leading manufacturer Toshiba. This product includes various capacities to choose from.

M350 family offers outstanding performance and reliability; the product family is a perfect solution for price sensitive semi-industrial and general industrial applications.




 
Series
Momentum Series (MLC)
Form Factor
Half Slim
Interface
SATA III 6.0Gb/s
Connector
SATA (7+15pin)
NAND Flash Type
MLC
Capacity
32GB ~ 128GB
Dimension (LxWxH/mm)
54.00 x 39.00 x 4.00
Sequential Read
up to 495MB/s
Sequential Write
up to 315MB/s
ECC Scheme
LPDC
MTBF
>3,000,000 hours
Terabyte Written (TBW)
32GB : 31, 64GB : 63, 128GB : 125
Operating Temperature: Standard Temp.
0°C ~ 70°C
Operating Temperature: Wide Temp.
–40°C ~ 85°C
Supply Voltage
5V DC +/-5%
Power Consumption
Active mode: < 1600mW, Idle mode: < 285mW
Conformal Coating
Optional
Anti-Vibration Fill
Optional
FlashMonitor
Standard Temp. (0°C ~ 70°C) Wide Temp. (-40°C ~ 85°C) Capacity
CIE-HSM350TJC032GS CIE-HSM350TJC032GW 32GB
CIE-HSM350TJC064GS CIE-HSM350TJC064GW 64GB
CIE-HSM350TKC128GS N/A 128GB
日期 文件类型 容量
2022.12.30 Cervoz_Industrial_Embedded_Module_Half_Slim_M350_Datasheet_Rev1.3 1.00 MB
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