Making Memories for Industry
Press Center
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29-06-2022
Accelerate AMRs Deployment
Accelerate AMRs Deployment with Cervoz For the past few years, businesses increasingly turned to automation to address the fast-changing environment as the Covid-19 virus beset the world. Artificial intelligence (AI), machine learning (ML), and even robots can accomplish jobs done by humans. Will they replace the human workforce? Some might tend to think it will be the case. But if there is ever a severe labor shortage, we will need all technological help. One of the earliest industries where robots are making the most significant impact is in the manufacturing domain. However, the advanced technology wave has pushed not only the robot itself to autonomous mobile robots but has also spread to various industrial fields, such as retail, banking, healthcare, and agriculture, to name a few. Why Adopt Autonomous Mobile Robots? Starting to leverage the technology of AMRs can transform a business workflow. AMRs provide other benefits as well. AMRs give manufacturers and distributors an automated way to transport materials from various loading locations to their unloading points, which improves the efficiency of intra-operational delivery. AMRs enable businesses to move materials safely with improved collaboration from low to high load transportation tasks. Using AMRs requires much less infrastructure since there are no magnetic tracks or wire strips necessary in their design. This allows businesses to optimize their shelving that best suits their workspace. Due to less infrastructure for building AMRs and improved collaboration between machines and humans, manufacturers and distributors experience significant cost savings that directly affect their budget bottom line. Challenge/ Requirement An autonomous mobile robot (AMR) must navigate safely through known and unknown environments while carrying out its assigned task in different work conditions with an uninterrupted system operation indoors and outdoors. Cervoz Solution for AMRs The ability of AMRs to operate in various complex and flexible environments depends on reliable and durable storage and memory solutions in their design. AMRs must perform complex real-time machine vision analysis and simultaneous localization and mapping (SLAM) algorithms. AMRs, like edge processors, must have sufficient processing and storage capabilities to perform the required complex processing. The Cervoz T376 family of storage products provides high capacity and high transmission speed ability to solve these challenges. Created with features including the high IOPS, 3D TLC-technology storage modules arrive in a wide temperature version with thermal sensors, conformal coating, a DRAM buffer, and the Cervoz Powerguard (power loss protection). Together, these features enable the products to perform at their optimum despite the AMRs operating in different temperature conditions. The Cervoz T376 family is in diverse form factors, from mainstream 2.5" SATA, m SATA SSD, and M.2 2280, all compliant with the SATA III interface. They would be the ideal selections for AMR applications. To add more endurance to performance, the Cervoz DDR4 wide-temperature SO-DIMM offer wide temperature flexibility (-40° to 85°C) and superior performance, a small form factor, ultra-low power consumption, and excellent reliability. All features make them perfect for space-constrained industrial applications, including AMRs. The Cervoz expansion cards provide extra I/O ports, technology, and functions. With Cervoz MEC products (MEC WiFi/MEC-LAN/MEC-COM), AMRs can do more beyond their connectivity limits and expectations. Cervoz memory and storage solutions are ideal for many of the demanding operating conditions and functions of AMRs. We deliver high reliability and stability for specific robotic tasks. Whether designing solutions for industries such as logistics, medical, delivery, or hospitality, Cervoz has solutions to meet AMRs application requirements. Contact Cervoz to accelerate your AMRs deployment
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27-06-2022
Thanks for visiting Cervoz at Embedded World 2022
Dear Valued Customer, Thank you from Cervoz for meeting with us and interacting with our product showcase at Embedded World 2022. We had a successful event and turn-out thanks to your interest. Demonstrations of our latest Memory and Storage Solutions caught the most attention. We are looking forward to working with new prospective clients. We are excited to help build the best solutions that allow our clients to stand out from their competition. We look forward to seeing you next year.
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15-06-2022
Cervoz High-Capacity Storages
Cervoz High-Capacity Storages for Data-Intensive Workloads The demand for HPC (high-performance computing) and big data systems has grown widely since they can process data and perform complex calculations at high speeds. Storage solutions for HPC applications must be reliable, with high capacity and transmission speed, and withstand high temperatures and even overheating. Cervoz High-Capacity Storages Promotion Cervoz offers a wide range of high-capacity storage solutions that are highly reliable, fast, compact, and can operate stably from -40˚C to 85˚C. They are ideal for data-intensive HPC workloads to perform at their peak. In addition, the specialized DRAM buffer and Powerguard (Power Loss Protection) mechanism improve the endurance of our flash modules. Explore Cervoz Storage Solutions Now Family T380 T385 T376 T405 T435 Interface SATA III SATA-III SATA-III PCIe Gen. 3x4 PCIe Gen. 3x4 Flash Type TLC Capacity 512GB/1TB/2TB 512GB/1TB Powerguard (Power Loss Protection) With DRAM Buffer Operating Temp. 0˚C~70˚C/-40˚C~85˚C Form Factors 2.5” SATA, M.2 2242/2280 2.5” SATA 2.5” SATA, M.2 2280 M.2 2242/ M.2 2280 M.2 2242/ M.2 2280 Read also: Cervoz Solution in Distributed AI Next-Generation Server Solution Cervoz 3D NAND Flash Storage Solution Contact a Cervoz Sales Representative to learn more!
Technology
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3D NAND Flash
3D NAND is the latest in flash memory technology that has significantly increased performance and capacity for each unit of cell. While 2D NAND builds a flat, one-story cell structure, 3D NAND takes advantage of the space above, building a vertical structure that can therefore accomplish more. With 3D NAND flash, the SSD performs faster and better while consuming less power and costing less per GB. 3D NAND is developed and designed to overcome the limitations of current planar technology, accomplishing the aforementioned advantages without sacrificing product reliability.
Products
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Industrial SSD
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Industrial Memory Card
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Industrial Embedded Module
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Industrial DRAM Module
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Modular Expansion Card
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Storage Enclosure