Making Memories for Industry
Press Center
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11-05-2022
Smart Bus Solutions
Today, over 50% of the world's population lives in urban areas. The portion is estimated to reach nearly 70% by 2050, making transportation one of the toughest challenges for cities around the globe. With the advancement of automotive IoT and 5G communication technologies, ITS (Intelligent Transportation Systems) is being implemented in many cities to improve traffic congestion, safety, and cost-effectiveness. Smart Public Transportations An ITS system is capable of making critical and timely traffic decisions from management centers or roadside infrastructure through networks of sensors, intelligent embedded solutions, distributed computing ability, and wireless connection capabilities. In other words, an ITS uses new and emerging technologies to make moving around a city more convenient, more cost-effective (for both the city and the individual), and safer. As environmental awareness rises, more and more local governments have set goals to raise the proportion of people using public transport. Many have embraced and developed intelligent public transportation systems to increase efficiency and safety with lower operating costs. Among all, smart buses are considered one of the most welcomed choices for their lower infrastructure costs and faster deployment. Smart Buses In addition, with video analytics ability and edge AI imbued, it becomes the key to automated services such as total passenger control and AFC (Automated Fare Collection). Meanwhile, smart buses interconnect with the surroundings and the control center through GNSS and IoT technologies. Hence the operator can conduct fleet management and provide better PIS (Passenger Information System) service that delivers essential real-time information to passengers. Furthermore, as smart buses collect traffic data continuously and collaboratively, operators can gain more insights to improve service, enhance utility efficiency, and rearrange routes or timetables when necessary. Challenges and Solutions Due to the ongoing development of in-vehicle surveillance, communication, and computing technologies, the demand for real-time massive data collection and analysis continues to grow, leveraging the need for large-capacity and high-transfer-speed storage solutions. However, when it comes to in-vehicle applications, the key lies in reliability against tough onboard situations and challenging environments, such as unstable power supply, vibration, extreme temperatures, and humidity Although high temperatures, shock, and vibrations can cause damage and severely reduce the lifespan of electronic devices, these factors are common for in-vehicle systems. All Cervoz in-vehicle products are compliant with ISO-16750-3 standards, ensuring that they can withstand shock and vibration for a continuous 24 hours, and survive a 100cm-6-face drop test. These stress tests simulate the actual conditions of vehicles in an outdoor operation. Our optional Anti-Vibration Fill also can help secure PCB and main chips in their place and prevent solder joints from coming loose. All Cervoz flash storage products come with wide temperature versions that can operate stably between -40˚C to 85˚C. In addition, our in-house developed conformal coating is optional compliant to all our embedded products, protecting the storage from dust and humidity in vehicles. With the emergence of electric transportation, power supply instability and outages may pose problems for owners and operators. Cervoz Powerguard is our firmware-and-hardware integrated power loss protection technology. Powerguard provides additional power to the memory during an unexpected power outage to complete the current flash write operation and protect data integrity and the firmware. Meanwhile, its under-voltage protection feature prevents recording erroneous and incomplete data, which may damage data validity and the device during a power outage. Cervoz Industrial T376 family is a line-up of high-capacity and high-transmission-speed 3D TLC SSDs with Powerguard function and DRAM buffer design. The DRAM Buffer technology utilizes an additional DRAM that functions the way a cache does in a hard disk to increase the products' performance, endurance, and lifespan. The line-up consists of multiple form factors, including 2.5” SATA, mSATA, and M.2 2280, all compliant with the SATA III interface. Know more about Cervoz's solutions for: Smart EV Chargers Parking Lots Smart Traffic Management Contact a Cervoz Sales Rep. to learn more.
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27-04-2022
Distributed AI
Advancements in digitalization have brought us to this era of big data, and rocketed the development in AI (artificial intelligence), ML (machine learning), MEC (multi-access edge computing), HPC (high-performance computing), etc. Distributed AI As IoT and 5G technologies thrive, increasing devices collect and generate colossal amounts of data on a millisecond basis. Sending inundated data back and forth to the cloud and center for storage and processing is relatively inefficient and expensive. Also, there is not enough bandwidth when increasing machines are becoming interconnected. With distributed AI deployment, mundane AI tasks such as data collating and basic processing are allocated to edge devices with moderate memory and computing power like industrial endpoints and local 5G base stations. These edge appliances are imbued with enough intelligence to ensure only relevant and valuable data is sent to central AI for crunching. Allowing it to learn faster, infer deeper, and achieve more with lower costs, less bandwidth, and power consumption. One trending application case is IVA (edge-based Intelligent Video Analytics) solutions for traffic management. IVA helps to ease traffic congestion by monitoring the road conditions in real-time and taking timely action locally, without dependency on time-consuming video transmission and analytics from the cloud. It also reduces the cost for massive data transmission and intense cloud services from the broad and geographical deployment of monitors, signals, and devices. Memory in Distributed AI Continuous data input from edge endpoints has incrementally trained and optimized the neuro networks and central ML models. The retrained central AI then feedback refined algorithms to the edge for better predecessor results. It's a continuous cycle of improvement. Cervoz Solutions Unlike traditional 2D NAND with flat and one-story cell structures, the vertical structure of 3D NAND flash memory technology has taken advantage of the space above and significantly increased performance and capacity for each unit while consuming less power and costing less per GB. Cervoz offers a range of affordable high IOPS 3D TLC solutions in diverse form factors, from mainstream 2.5" SSD to slim and compact embedded modules including M.2 2242/ 2280, mSATA, Half-size mSATA, and Half Slim. Cervoz DDR4 32GB 3200MHz DRAM in DIMM and SO-DIMM modules feature high capacity, transmission speed, and reliable JEDEC-standard-quality, making it ideal for working with massive datasets in AI applications. Furthermore, the DDR4 series consumes 20% less power compared to predecessor DDR3. There's also DDR4 SO-DIMM Very Low Profile Industrial Memory Module, the miniature version, saving 40% space, and is suitable for any edge device with a dense enclosure. Read also: ▪ Cervoz 3D NAND Flash Storage Solution ▪ Next-Generation Server Solution Contact a Cervoz Sales Rep. to learn more!
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13-04-2022
New DDR5 Industrial Grade DRAM Modules
Cervoz Announces New DDR5 Industrial Grade DRAM Modules for Diversified Industrial Applications Cervoz announces the introduction of new industrial-grade DDR5 memory modules, DIMM and SO-DIMM 8G~32G, that feature enhanced capacity, stability, and power efficiency for high-bandwidth industrial applications such as data centers, AIoT, and machine learning. DDR5 DRAM Solutions The new DIMM channel architecture is updated with two independent 40-bit (32 data bits with eight ECC bits) subchannels per memory module (DIMM). With this new architecture, Cervoz DDR5 will significantly increase memory access efficiency and lower the latencies of data accesses for the memory controller. Besides increased memory bandwidth, DDR5 will allow for individual memory chips up to 64Gbit in density, which is 4 time higher than DDR4's 16Gbit density maximum, enabling higher-capacity DIMMS. DDR5 debuts at 4800MT/s, while DDR4 tops out at 3200MT/s, a 50% increase in bandwidth. In cadence with compute platform releases, DDR5 has planned performance increases that will scale to 6400MT/s, ideal for edge computing, IoT, 5G, surveillance, and industrial PC-related applications. With on-die ECC (Error Correction Code), the DDR5 modules keep the system stable by self-correcting errors, effectively improving transmission reliability. ECC-enabled processors for servers and workstations feature the coding to correct single or multi-bit errors. Cervoz industrial-grade DDR5 memory modules use original high-quality IC and capacities of 8GB ~ 32GB. Cervoz DDR5 is set to supersede DDR4 in almost every area – faster speeds, greater bandwidth, better power efficiency. For more information about Cervoz DDR5, please contact a Cervoz Sales Representative!
Technology
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3D NAND Flash
3D NAND is the latest in flash memory technology that has significantly increased performance and capacity for each unit of cell. While 2D NAND builds a flat, one-story cell structure, 3D NAND takes advantage of the space above, building a vertical structure that can therefore accomplish more. With 3D NAND flash, the SSD performs faster and better while consuming less power and costing less per GB. 3D NAND is developed and designed to overcome the limitations of current planar technology, accomplishing the aforementioned advantages without sacrificing product reliability.
Products
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Industrial SSD
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Industrial Memory Card
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Industrial Embedded Module
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Industrial DRAM Module
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Modular Expansion Card
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Storage Enclosure