Half Slim
Cervoz Half Slim target embedded applications which require storage in small, removable form factors. Cervoz Embedded modules withstand high shock and vibration and offer superior performance and endurance. Meanwhile, Cervoz Value-Added Service, Anti-Vibration Fill, improves resistance against the double pull-out force and Conformal Coating effectively protects against moisture and dust in harsh environments.
Titian (TLC) Series adopts the latest 3D NAND technology to meet high performance and big capacity industrial application needs.
| Model No. | Interface Compliance | Density | Sequential Read | Sequential Write |
|---|---|---|---|---|
|
T380 Family
|
SATA III 6.0Gb/s | 64G~2TB | up to 560MB/s | up to 505MB/s |
