News Release


  • 10-08-2022
    New Power Over Ethernet Modular Expansion Card

      Cervoz Launches New Modular Expansion Card - PCIe Ethernet Solution for Various Industrial Applications Cervoz introduces an Industrial Ethernet Modular Expansion Card, MEC-LAN-P004, with Power-over-Ethernet Plus (PoE+) technology, an optional feature that guarantees reliable power and data transmission through a single Ethernet cable. As a cost-effective solution to expand the Gigabit network, this product is ideal for applications in public transportation, HMI and machine vision in industrial automation. MEC-LAN-P004, a PCI Express x4 with four isolated GbE LAN ports, and four independent Power Source Equipment (PSE) channels based on Intel I210 controller, has flexible input of 12~24V from PCI Express ATX 6PIN. It meets the IEEE 802.3 at standards and provides up to 25.5W of PoE power for each port, eliminating the need for power wiring. Cervoz provides an add-on Power over Ethernet Plus (PoE+) module, an enhancement to PoE, on MEC-LAN-P004 to meet the dynamic demands of industrial markets using PoE applications in their day-to-day operations, such as machine vision, factory automation, and surveillance. MEC-LAN-P004 has four Ethernet ports that support 10/100/1000Mbps Ethernet connectivity with auto-negotiation and IEEE 802.3x flow control. MEC-LAN-P004 is developed based on Intel I210 controller to adapt higher-performance network communication in Gigabit Ethernet connection. The MEC-LAN-P004 is designed to be flexible for various applications. In addition, accessories (heatsinks, bracket) are included in the standard package.   Explore Cervoz New Ethernet Expansion Card Now - MEC-LAN-P004 for additional information, please contact Cervoz Now!  

  • 13-07-2022
    Embedded System Solutions

      Cervoz Storage Solution Delivers Incredible Agility with Infinite Possibilities for Embedded Systems Embedded systems are a part of our everyday life. They are designed for specific tasks compared to general-purpose computers. When enterprises first deployed embedded systems, the sheer volume of data that AI, the Internet of Things (IoT), and other advanced technologies would generate was inconceivable to the system architects. Simply put, as the IoT boom continues, these embedded systems will constantly generate a massive influx of data that will need to be channeled and processed. Meanwhile, the increasing scalability of connected devices in any industrial application requires highly reliable communication products. Hence a demand for industrial storage is rapidly growing. Requirement for an Embedded System Unlike typical computers that allow users to perform multiple tasks simultaneously, embedded systems are task-specific and are expected to function for extended periods even in a harsh environment. An Embedded system may be part of larger computer systems or self-contained systems. Due to space constraints, maintenance can be extremely difficult for all the electronic components in compact industrial PCs, especially for those deployed in hard-to-reach locations, such as space stations and undersea installations.   Embedded systems typically provide 24-hour uninterrupted operation to sustain the running applications and provide constant services.   It must dissipate heat effectively, operate reliably for long periods and withstand environmental hazards such as extreme temperatures, dust, humidity, and shock/vibration.   An industrial compact PC contains numerous PCIe slots, multiple storage form factor slots, communication interfaces, and expandable memory to meet various requirements of industrial applications.   Explore Cervoz Storage Solutions Now   A perfect memory and storage solution for an industrial PC is one that is highly reliable, stable, power-efficient, and capable of constant operation under diverse workloads in harsh environments.   Cervoz offers a range of 3D TLC-based storage solutions in diverse form factors, from mainstream 2.5"SSD to slim and compact embedded modules including M.2 2242/2280, mSATA, Half-size mSATA, and Half Slim.   Cervoz industrial-grade NVMe PCIe Gen4x4 SSD features the latest NAND technology with large storage capacities, offering temperature tolerance from -40˚C~85˚C. Cervoz NVMe PCIe Gen4x4 SSD's speed is 3.5 times faster when compared to Gen3x4 SSD. It greatly benefits industrial PC applications, especially for server and cloud computing.   Cervoz DDR5 is set to offer more efficient and faster memory with higher capacities and less power consumption. Applications for the Cevoz DDR5 industrial wide temperature memory products include usage in edge computing, high-performance servers, and any industrial PC related applications.   The design goals of industrial computers include miniaturization, increased performance, longer product life, and silent operation. These goals run counter to effective thermal management, and designers face the prospect of sacrificing performance to handle the excessive heat that modern ICs generate. Cervoz offers comprehensive solutions for overheating, including the Dynamic Thermal Throttling mechanism, which activates automatically to cool the SSD down.   Power loss protection is a crucial mechanism to protect data stored in an SSD during a power outage, which is critical in the reliability of the embedded system. Cervoz Powerguard function for the flash module is designed to prevent data loss and ensure the stability of data transmission during an unstable power supply situation. It's a must-have technology for industrial computers in any application.   Cervoz meets the demand of today's industrial computers: multi-functionality, performance, speed, and endurance in the face of many challenges. There is no one-size-fits-all computer to fulfill all the needs of different industrial applications. Still, with modular expansion cards, industrial PCs can extend their computers with more functionality. At Cervoz, we are in the business of designing and developing modular expansion card (MEC) products for different functions. The Cervoz expansion cards provide extra I/O ports, technology, and functions. With Cervoz MEC products, Industrial PC systems can do more.   Whether we're walking around with any advanced technologies or not, it is evident that the range of industries for embedded systems continues to expand. It means data volumes will continue to increase and the need for more storages that are faster, longer-lasting, and more resistant to different harsh environments will rise. Cervoz delivers a rich portfolio of high-quality industrial-grade storage and memory products for embedded systems in various applications, such as Factory Automation, Healthcare, Defense and Military, Transportation, and Telecommunication Networks, among many others. Contact Cervoz for more industrial solutions.   Read More: Understanding the IPC Market  

  • 29-06-2022
    Accelerate AMRs Deployment

      Accelerate AMRs Deployment with Cervoz For the past few years, businesses increasingly turned to automation to address the fast-changing environment as the Covid-19 virus beset the world. Artificial intelligence (AI), machine learning (ML), and even robots can accomplish jobs done by humans. Will they replace the human workforce? Some might tend to think it will be the case. But if there is ever a severe labor shortage, we will need all technological help. One of the earliest industries where robots are making the most significant impact is in the manufacturing domain. However, the advanced technology wave has pushed not only the robot itself to autonomous mobile robots but has also spread to various industrial fields, such as retail, banking, healthcare, and agriculture, to name a few. Why Adopt Autonomous Mobile Robots? Starting to leverage the technology of AMRs can transform a business workflow. AMRs provide other benefits as well. AMRs give manufacturers and distributors an automated way to transport materials from various loading locations to their unloading points, which improves the efficiency of intra-operational delivery. AMRs enable businesses to move materials safely with improved collaboration from low to high load transportation tasks. Using AMRs requires much less infrastructure since there are no magnetic tracks or wire strips necessary in their design. This allows businesses to optimize their shelving that best suits their workspace. Due to less infrastructure for building AMRs and improved collaboration between machines and humans, manufacturers and distributors experience significant cost savings that directly affect their budget bottom line. Challenge/ Requirement An autonomous mobile robot (AMR) must navigate safely through known and unknown environments while carrying out its assigned task in different work conditions with an uninterrupted system operation indoors and outdoors.           Cervoz Solution for AMRs The ability of AMRs to operate in various complex and flexible environments depends on reliable and durable storage and memory solutions in their design. AMRs must perform complex real-time machine vision analysis and simultaneous localization and mapping (SLAM) algorithms. AMRs, like edge processors, must have sufficient processing and storage capabilities to perform the required complex processing. The Cervoz T376 family of storage products provides high capacity and high transmission speed ability to solve these challenges. Created with features including the high IOPS, 3D TLC-technology storage modules arrive in a wide temperature version with thermal sensors, conformal coating, a DRAM buffer, and the Cervoz Powerguard (power loss protection). Together, these features enable the products to perform at their optimum despite the AMRs operating in different temperature conditions. The Cervoz T376 family is in diverse form factors, from mainstream 2.5" SATA, m SATA SSD, and M.2 2280, all compliant with the SATA III interface. They would be the ideal selections for AMR applications. To add more endurance to performance, the Cervoz DDR4 wide-temperature SO-DIMM offer wide temperature flexibility (-40° to 85°C) and superior performance, a small form factor, ultra-low power consumption, and excellent reliability. All features make them perfect for space-constrained industrial applications, including AMRs. The Cervoz expansion cards provide extra I/O ports, technology, and functions. With Cervoz MEC products (MEC WiFi/MEC-LAN/MEC-COM), AMRs can do more beyond their connectivity limits and expectations. Cervoz memory and storage solutions are ideal for many of the demanding operating conditions and functions of AMRs. We deliver high reliability and stability for specific robotic tasks. Whether designing solutions for industries such as logistics, medical, delivery, or hospitality, Cervoz has solutions to meet AMRs application requirements. Contact Cervoz to accelerate your AMRs deployment  

  • 15-06-2022
    Cervoz High-Capacity Storages

      Cervoz High-Capacity Storages for Data-Intensive Workloads The demand for HPC (high-performance computing) and big data systems has grown widely since they can process data and perform complex calculations at high speeds. Storage solutions for HPC applications must be reliable, with high capacity and transmission speed, and withstand high temperatures and even overheating.   Cervoz High-Capacity Storages Promotion   Cervoz offers a wide range of high-capacity storage solutions that are highly reliable, fast, compact, and can operate stably from -40˚C to 85˚C. They are ideal for data-intensive HPC workloads to perform at their peak. In addition, the specialized DRAM buffer and Powerguard (Power Loss Protection) mechanism improve the endurance of our flash modules.   Explore Cervoz Storage Solutions Now   Family T380 T385 T376 T405 T435 Interface SATA III  SATA-III  SATA-III PCIe Gen. 3x4 PCIe Gen. 3x4 Flash Type TLC Capacity 512GB/1TB/2TB 512GB/1TB Powerguard (Power Loss Protection) With DRAM Buffer Operating Temp. 0˚C~70˚C/-40˚C~85˚C Form Factors 2.5” SATA, M.2 2242/2280 2.5” SATA 2.5” SATA, M.2 2280 M.2 2242/ M.2 2280 M.2 2242/ M.2 2280   Read also: Cervoz Solution in Distributed AI Next-Generation Server Solution Cervoz 3D NAND Flash Storage Solution   Contact a Cervoz Sales Representative to learn more!  

  • 11-05-2022
    Smart Bus Solutions

      Today, over 50% of the world's population lives in urban areas. The portion is estimated to reach nearly 70% by 2050, making transportation one of the toughest challenges for cities around the globe. With the advancement of automotive IoT and 5G communication technologies, ITS (Intelligent Transportation Systems) is being implemented in many cities to improve traffic congestion, safety, and cost-effectiveness. Smart Public Transportations An ITS system is capable of making critical and timely traffic decisions from management centers or roadside infrastructure through networks of sensors, intelligent embedded solutions, distributed computing ability, and wireless connection capabilities. In other words, an ITS uses new and emerging technologies to make moving around a city more convenient, more cost-effective (for both the city and the individual), and safer.  As environmental awareness rises, more and more local governments have set goals to raise the proportion of people using public transport. Many have embraced and developed intelligent public transportation systems to increase efficiency and safety with lower operating costs. Among all, smart buses are considered one of the most welcomed choices for their lower infrastructure costs and faster deployment. Smart Buses         In addition, with video analytics ability and edge AI imbued, it becomes the key to automated services such as total passenger control and AFC (Automated Fare Collection). Meanwhile, smart buses interconnect with the surroundings and the control center through GNSS and IoT technologies. Hence the operator can conduct fleet management and provide better PIS (Passenger Information System) service that delivers essential real-time information to passengers. Furthermore, as smart buses collect traffic data continuously and collaboratively, operators can gain more insights to improve service, enhance utility efficiency, and rearrange routes or timetables when necessary.   Challenges and Solutions Due to the ongoing development of in-vehicle surveillance, communication, and computing technologies, the demand for real-time massive data collection and analysis continues to grow, leveraging the need for large-capacity and high-transfer-speed storage solutions. However, when it comes to in-vehicle applications, the key lies in reliability against tough onboard situations and challenging environments, such as unstable power supply, vibration, extreme temperatures, and humidity Although high temperatures, shock, and vibrations can cause damage and severely reduce the lifespan of electronic devices, these factors are common for in-vehicle systems. All Cervoz in-vehicle products are compliant with ISO-16750-3 standards, ensuring that they can withstand shock and vibration for a continuous 24 hours, and survive a 100cm-6-face drop test. These stress tests simulate the actual conditions of vehicles in an outdoor operation. Our optional Anti-Vibration Fill also can help secure PCB and main chips in their place and prevent solder joints from coming loose. All Cervoz flash storage products come with wide temperature versions that can operate stably between -40˚C to 85˚C. In addition, our in-house developed conformal coating is optional compliant to all our embedded products, protecting the storage from dust and humidity in vehicles. With the emergence of electric transportation, power supply instability and outages may pose problems for owners and operators. Cervoz Powerguard is our firmware-and-hardware integrated power loss protection technology. Powerguard provides additional power to the memory during an unexpected power outage to complete the current flash write operation and protect data integrity and the firmware. Meanwhile, its under-voltage protection feature prevents recording erroneous and incomplete data, which may damage data validity and the device during a power outage. Cervoz Industrial T376 family is a line-up of high-capacity and high-transmission-speed 3D TLC SSDs with Powerguard function and DRAM buffer design. The DRAM Buffer technology utilizes an additional DRAM that functions the way a cache does in a hard disk to increase the products' performance, endurance, and lifespan. The line-up consists of multiple form factors, including 2.5” SATA, mSATA, and M.2 2280, all compliant with the SATA III interface. Know more about Cervoz's solutions for: Smart EV Chargers Parking Lots Smart Traffic Management Contact a Cervoz Sales Rep. to learn more.

  • 27-04-2022
    Distributed AI

      Advancements in digitalization have brought us to this era of big data, and rocketed the development in AI (artificial intelligence), ML (machine learning), MEC (multi-access edge computing), HPC (high-performance computing), etc. Distributed AI   As IoT and 5G technologies thrive, increasing devices collect and generate colossal amounts of data on a millisecond basis. Sending inundated data back and forth to the cloud and center for storage and processing is relatively inefficient and expensive. Also, there is not enough bandwidth when increasing machines are becoming interconnected. With distributed AI deployment, mundane AI tasks such as data collating and basic processing are allocated to edge devices with moderate memory and computing power like industrial endpoints and local 5G base stations. These edge appliances are imbued with enough intelligence to ensure only relevant and valuable data is sent to central AI for crunching. Allowing it to learn faster, infer deeper, and achieve more with lower costs, less bandwidth, and power consumption. One trending application case is IVA (edge-based Intelligent Video Analytics) solutions for traffic management. IVA helps to ease traffic congestion by monitoring the road conditions in real-time and taking timely action locally, without dependency on time-consuming video transmission and analytics from the cloud. It also reduces the cost for massive data transmission and intense cloud services from the broad and geographical deployment of monitors, signals, and devices.       Memory in Distributed AI Continuous data input from edge endpoints has incrementally trained and optimized the neuro networks and central ML models. The retrained central AI then feedback refined algorithms to the edge for better predecessor results. It's a continuous cycle of improvement.          Cervoz Solutions Unlike traditional 2D NAND with flat and one-story cell structures, the vertical structure of 3D NAND flash memory technology has taken advantage of the space above and significantly increased performance and capacity for each unit while consuming less power and costing less per GB. Cervoz offers a range of affordable high IOPS 3D TLC solutions in diverse form factors, from mainstream 2.5" SSD to slim and compact embedded modules including M.2 2242/ 2280, mSATA, Half-size mSATA, and Half Slim. Cervoz DDR4 32GB 3200MHz DRAM in DIMM and SO-DIMM modules feature high capacity, transmission speed, and reliable JEDEC-standard-quality, making it ideal for working with massive datasets in AI applications. Furthermore, the DDR4 series consumes 20% less power compared to predecessor DDR3. There's also DDR4 SO-DIMM Very Low Profile Industrial Memory Module, the miniature version, saving 40% space, and is suitable for any edge device with a dense enclosure. Read also: ▪ Cervoz 3D NAND Flash Storage Solution ▪ Next-Generation Server Solution Contact a Cervoz Sales Rep. to learn more!  

  • 13-04-2022
    New DDR5 Industrial Grade DRAM Modules

      Cervoz Announces New DDR5 Industrial Grade DRAM Modules for Diversified Industrial Applications   Cervoz announces the introduction of new industrial-grade DDR5 memory modules, DIMM and SO-DIMM 8G~32G, that feature enhanced capacity, stability, and power efficiency for high-bandwidth industrial applications such as data centers, AIoT, and machine learning.    DDR5 DRAM Solutions The new DIMM channel architecture is updated with two independent 40-bit (32 data bits with eight ECC bits) subchannels per memory module (DIMM). With this new architecture, Cervoz DDR5 will significantly increase memory access efficiency and lower the latencies of data accesses for the memory controller. Besides increased memory bandwidth, DDR5 will allow for individual memory chips up to 64Gbit in density, which is 4 time higher than DDR4's 16Gbit density maximum, enabling higher-capacity DIMMS. DDR5 debuts at 4800MT/s, while DDR4 tops out at 3200MT/s, a 50% increase in bandwidth. In cadence with compute platform releases, DDR5 has planned performance increases that will scale to 6400MT/s, ideal for edge computing, IoT, 5G, surveillance, and industrial PC-related applications. With on-die ECC (Error Correction Code), the DDR5 modules keep the system stable by self-correcting errors, effectively improving transmission reliability. ECC-enabled processors for servers and workstations feature the coding to correct single or multi-bit errors. Cervoz industrial-grade DDR5 memory modules use original high-quality IC and capacities of 8GB ~ 32GB. Cervoz DDR5 is set to supersede DDR4 in almost every area – faster speeds, greater bandwidth, better power efficiency. For more information about Cervoz DDR5, please contact a Cervoz Sales Representative!  

  • 06-04-2022
    New M.2 Expansion Solutions

      Big Performance in Small Packages Cervoz Industrial Modular Expansion Card (MEC) product lineup covers a broad range of expansion applications from Ethernet, Serial, USB, Display, SATA, and WiFi to provide flexible integration and cost-effectiveness to your total system solution. All MEC products undergo rigorous test procedures to ensure functionality, compatibility, and reliability. New M.2 Expansion Card MEC product line has mini PCIe and M.2 (B+M key) 2242/2260/2280 form factors. The new M.2 (B+M key) 2242/2260/2280 form factor is a three-in-one card designed with flexibility in mind. MEC-LAN solutions for Ethernet connection expansion, MEC-COM, and MEC-USB for serial and USB solutions. The product comes in the M.2 2280 form factor but can be broken off to become an M.2 2260 or broken down further into an M.2 2242. The flexibility to shorten the MEC products allows customers to order one product that works for multiple locations on an application device's motherboard and their respective space constraints.                                  Cervoz New M.2 MEC modules stand out for their compact and flexible design, especially for industrial embedded systems. Explore Cervoz New M.2 Expansion Card Solution Now                                                                                                                                                  Contact a Cervoz Sales Representative to learn more about flexible MEC-LAN/ COM/ USB solutions!  

  • 16-03-2022
    New Era of Smart Healthcare

      The world changed with the COVID-19 pandemic—and so did healthcare. To prevent the virus from further spread while we are in the midst of this pandemic, many countries have proposed "zero-contact diagnosis and treatment”. According to research firm ReportLinker, the global telemedicine market is expected to reach US$218.5 billion in 2025, a compound annual growth rate (CAGR) of 28.34 percent.   Why Telemedicine?   Telemedicine enables a new standard of care by keeping patients better connected with their doctors and allowing both patients and doctors to avoid high-risk environments.   Telemedicine allows people to access care in the comfort and convenience of their homes. Virtual visits are easier to fit into your busy schedule. It reduces travel, expense and time away from home.   Going to the hospital or clinic means being around people who may be infectious. With Telemedicine, your exposure to other people's germs is minimized, which helps everyone, especially the ones who are most vulnerable (i.e, - pregnant elderly, immunocompromised).   Telemedicine technology enables frequent patient monitoring and data collection to support faster diagnosis and appropriate treatment. It improves access to healthcare providers, continuity and quality of care. Challenge of Telemedicine Healthcare data do come from many different sources. From patient forms to test results and diagnostic imaging, every patient accumulates a sizable electronic health record.             What Cervoz can offer Cervoz storage products meet the demands of telemedicine applications such as industrial-grade 2.5”/M.2 SSDs for medical equipment and data centers, and mSATA SSDs and CF/Cfast cards for medical devices. All Cervoz industrial-grade storage products undergo rigorous testing procedures to ensure functionality, high durability, and reliability. Furthermore, Cervoz RO-MLC, 3D MLC and 3D TLC flash storage offers high-speed calculation with lower power consumption, allowing telemedicine services to gather, store, and process data instantaneously with ease .   In the legal aspect of telemedicine, the interaction between doctors and patients must be recorded to avoid medical disputes and aid further diagnosis. It is also necessary to encrypt the process and ensure the communication between the patient and the doctor is safe. Data security and data integrity are essential for telemedicine. Cervoz data protection technologies such as AES 256-bit encryption and write-protect function can help protect patient information that is transmitted over telemedicine IoT devices and other endpoints. M339 and T376 family are two of the best storage solutions for telemedicine applications.   Cervoz flash module products, such as R336/M336/T376 family, come with the Powerguard function to offer extra power during a power failure to preserve patients' data integrity. Meanwhile, longevity of telemedicine devices should be considered to ensure 100% compatibility and interoperability. Cervoz has established successful product management processes for legacy products, simplifying the transition to alternative solutions.   If you are looking for a storage solution provider for telemedicine services, please contact Cervoz to ensure you will not miss the opportunity to take full advantage of what telemedicine has to offer.  

  • 16-02-2022
    Solutions for Smart EV Chargers

      Transportation is Going Electric   Have you noticed that there is an ongoing revolution around your daily commute? As governments successively announce policies targeting zero-emissions transportation, electric vehicles (EVs) are now snowballing in global popularity and market, around 160% increase in sales in H1 of 2021 compared to 2020, and is estimated to keep expanding significantly for the upcoming years. While the popularity and market of EVs continue to rise, so do electric vehicle chargers. *According to Canalys and GlobeNewswire reports.   Interconnected Smart EV Charging   Interconnectivity is trending in transportation, such as vehicles to home (V2H), vehicles to grid (V2G), even vehicles to everything (V2X). The trend has shaped the development of EV charging from fixed-point stations to widespread interoperable units, from standalone to interconnected Smart EV Charging devices.   Smart EV chargers are interconnected while sharing a data connection with electric vehicles and their operators. The interoperability allows vehicle owners to track charging progress remotely and know nearby chargers' vacancies during their drive. In addition, interconnected EV chargers allow operators to conduct cloud-based and scalable management, real-time monitor, remote software update, and optimize electricity distribution.        Challenges and Cervoz Solutions Since drivers who use EV chargers are usually active, dynamic, and on-the-road, status information from a Smart EV charging devices such as vacancy and malfunction is required to be real-time, prompt, and reliable. Thus, the Smart EV charging operators who can provide instant and reliable services are able to maximize operational benefits and attract more EV drivers to use their service. Cervoz Industrial Embedded Modules are able to assure the data transmission in real-time and reliable. The T405 Family, are a series of SSD products compliant with PCIe Gen 3x4, available in M.2 2242 and 2280 form factors. The NVM Express compliance enables the series to read and write at their maximum speed. The T405 Family uses 3D TLC flash memory from Micron, the industry-leading manufacturer, to achieve smaller cell sizes, higher circulation speed, and power efficiency. There is also the T435 Family who owns all the above features and comes with a specially designed DRAM buffer to optimize storage endurance and lifespan. Most of the EV chargers locate outdoor, facing diverse weather. Meanwhile, electrical equipment as such is usually with high operating temperature. Cervoz flash modules support wide operating temperatures (-40˚C~85˚C), enabling them to work perfectly within extreme environmental conditions. Also, an in-house developed conformal coating is optional and compliant to all our embedded products, protecting storage against outdoor environment challenges such as moisture, dust, thermal shocks, and sunlight. Cervoz offers comprehensive solutions for overheating, including the Dynamic Thermal Throttling mechanism, which activates automatically to cool the device down. On the hardware front, Cervoz provides additional heat dissipation solutions for high data transmitting products like T405 and T435. Read also: ▪ Know more about Cervoz Over Heating Solutions ▪ Independent Review of T435 Family by Rugged PC Review Contact a Cervoz Sales Rep. to learn more!