Distributed AI

Advancements in digitalization have brought us to this era of big data, and rocketed the development in AI (artificial intelligence), ML (machine learning), MEC (multi-access edge computing), HPC (high-performance computing), etc.

Memory in Distributed AI

Continuous data input from edge endpoints has incrementally trained and optimized the neuro networks and central ML models. The retrained central AI then feedback refined algorithms to the edge for better predecessor results. It's a continuous cycle of improvement.

 Cervoz Solutions

Unlike traditional 2D NAND with flat and one-story cell structures, the vertical structure of 3D NAND flash memory technology has taken advantage of the space above and significantly increased performance and capacity for each unit while consuming less power and costing less per GB. Cervoz offers a range of affordable high IOPS 3D TLC solutions in diverse form factors, from mainstream 2.5" SSD to slim and compact embedded modules including M.2 2242/ 2280, mSATA, Half-size mSATA, and Half Slim.

Cervoz DDR4 32GB 3200MHz DRAM in DIMM and SO-DIMM modules feature high capacity, transmission speed, and reliable JEDEC-standard-quality, making it ideal for working with massive datasets in AI applications. Furthermore, the DDR4 series consumes 20% less power compared to predecessor DDR3. There's also DDR4 SO-DIMM Very Low Profile Industrial Memory Module, the miniature version, saving 40% space, and is suitable for any edge device with a dense enclosure.

Read also:
▪ Cervoz 3D NAND Flash Storage Solution
▪ Next-Generation Server Solution